(0.80 mm) .0315" qse series f-217 specifications board mates: qte cable mates: eqcd, eqdp (see also available note) standoffs: so qse pins per row no. of pairs plating option C020, C040, C060 (40 total pins per bank = Cd) C014, C028, C042 (14 pairs per bank = CdCdp) Cd = single- ended CdCdp = differential pair (C01 only) type a other option 01 (0.64) .025 (20.00) .7875 ?d = (no. of positions per row/20) x (20.00) .7875 + (1.27) .050 ?d?dp = (no. of positions per row/14) x (20.00) .7875 + (1.27) .050 01 02 (7.49) .295 (0.15) .006 (0.80) .0315 (3.25) .128 (3.05) .120 (0.76) .030 (7.24) .285 (0.89) .035 dia Cl Cgp = guide post (C020 only) Ck = (8.25 mm) .325" dia polyimide film pick & place pad Ctr = tape & reel packaging Cl = latching option (n/a on C042 & C060 positions) Cf = gold flash on signal pins and ground plane, matte tin on tails Cl = 10 " (0.25 m) gold on signal pins and ground plane, matte tin on tails Cc* = electro-polished selective 50 " (1.27 m) min au over 150 " (3.81 m) ni on signal pins in contact area, 10 " (0.25 m) min au over 50 " (1.27 m) ni on ground plane in contact area, matte tin over 50 " (1.27 m) min ni on all solder tails high-speed ground plane socket qte lead style mated height with qse* C01 (5.00) .197 C02 (8.00) .315 C03 (11.00) .433 C04 (16.00) .630 C05 (19.00) .748 C07 (25.00) .984 C09 (14.00) .551 *processing conditions will affect mated height. see so series for board space tolerances for complete specifcations and recommended pcb layouts see www.samtec.com?qse insulator material: liquid crystal polymer terminal material: phosphor bronze plating: au or sn over 50 " (1.27 m) ni current rating: contacts: 2 a per pin (1 pin powered per row) ground plane: 23 a per ground plane (1 ground plane powered) operating temp range: -55 c to +125 c voltage rating: 225 vac (5 mm stack height) max cycles: 100 rohs compliant: ye s for complete scope of recognitions see www.samtec.com/quality recognitions protocols processing also available (moq required) ? 15 mm, 22 mm and 30 mm stack height ? 30 " (0.76 m) gold (specify -h plating for data rate cable mating applications.) ? edge mount ? 56 (-dp), 80, 100 positions per row ? retention, guide posts and friction lock options . contact samtec. ? 100 gbe ? xaui ? pci express ? ? s ata ? mgt (rocket i/o) ? infniband ? *note: Cc plating passes 10 year mfg testing note: some lengths, styles and options are non-standard, non-returnable. leadCfree solderable: ye s smt lead coplanarity: (0.10 mm) .004" max (020-060) board stacking: for applications requiring more than two connectors per board contact ipg@samtec.com gbps 2 8 high-speed channel performance qse-dp/qte-dp @ 5 mm mated stack height rating based on samtec reference channel. for full si performance data visit samtec.com or contact sig@samtec.com file no. e111594 file no: 090871_0_000 ex tended life pr oduc t 10 year mfg with 50 " gold high ma ting cycles ? qseC060C01CfCdCa qseC028C01CfCdCdpCa qseC020C01ClCdCa blade & beam design integral metal plane for power or ground www.samtec.com due to technical progress, all designs, specifcations and components are subject to change without notice.
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